Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown reverse costing report published by Yole Developpement

Information about Yole Intel RealSense 3D camera module and STM IR laser 2015 teardown...

Published on September 28, 2015

Author: Yole_Developpement

Source: slideshare.net

Content

1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected] September 2015 – written by David Le Gac

2. RealSense 3D Camera Module Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 2 1. Overview/Introduction 3 – Introduction – Company Profile : Intel – Reverse Costing Methodology 2. Physical Analysis 7  RealSense DK Teardown  RealSense 3D Camera Module Views  RealSense 3D Camera Module Teardown  Electronic Boards • Main Board – Top Side – Global View • Main Board – Top Side – High Definition Photo • Main Board – Top Side – Components Markings • Main Board – Top Side – Components Identification • Main Board – Bottom Side – Global View • Main Board – Bottom Side – High Definition Photo • Main Board – Bottom Side – Markings • Sensors Board • IR Laser Projector Board 3. Cost Analysis 33 – Accessing the BOM – Estimation of the cost of the PCBs – Estimation of the Cost of the Intel S419NN68 – Estimation of the Cost of the Aptina Visible Sensor – Estimation of the Cost of the Torex IR Sensor – BOM Cost - Main Board – BOM Cost - Sensors Board – BOM Cost – IR Laser Projector Board – Material Cost Breakdown – Accessing the Added Value (AV) cost – Main Board Manufacturing Flow – Details of the Main Board AV Cost – Details of the 3D Camera Module Assembly AV Cost – Added Value Cost Breakdown – Manufacturing Cost Breakdown 4. Estimated Price Analysis 62 – Estimation of the Manufacturing Price - Intel Contact 65

3. RealSense 3D Camera Module Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 3 This Reverse Costing analysis has been conducted in several phases : • The initialization of the analysis Pictures of the elements to be studied. Identification of the components. • Description of the material in the “SYScost+” software Creation of an “estimation project” of the studied board with SYScost+software. Construction of the Bill of Material (BOM). • Assessing the material Searching for the price of each reference among distributors and manufacturers. Assessing the cost of the PCB and of the unaccounted references (unknown by distributors) The BOM is valued with SYScost+ : price simulation according to the requested quantities. • Assessing the assembling and test phases Assembly and test lines are modeled with the SYScost+ software. The assembly and tests costs are estimated. • Production cost & selling price Estimation of the production cost & selling price. • Report A report is edited. SYScost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.

4. RealSense 3D Camera Module Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 4 IR Camera Full HD 1080p Image Sensor Power Led Indicator IR Laser Projector Front view. Rear view. Side view. Shielding Thermal Paste Sheet 110mm 12.5mm

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9. RealSense 3D Camera Module Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 9

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13. RealSense 3D Camera Module Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 13 September 2015 – Version 1 – Written by Sylvain HALLEREAU

14. RealSense 3D Camera Module Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 14 Glossary 1. Overview / Introduction 4 – Executive Summary – Reverse Costing Methodology 2. Company Profile 8 – STMicroelectronics 3. Physical Analysis 13 – Synthesis of the Physical Analysis – Physical Analysis Methodology – RealSense F200 15 – IR Laser Projector 18 – Package Views, Dimensions & Pin Out – Lens Line – Laser Diode – Resonant Micro-Mirror 30 – View, Dimensions & Marking – Opening – Resonant Micro-Mirror – Comb – Thickness – Bonding 4. Manufacturing Process Flow 45 – Global Overview – Micro-Mirror Process Flows – IR Sensor Wafer Fabrication Unit – Packaging Process Flows – Package Fabrication Unit 5. Cost Analysis 56 – Main steps of economic analysis – Yields Hypotheses – Micro-Mirror Front-End Cost – Micro-Mirror Front-End Step Cost – Micro-Mirror Die Cost – Packaging Cost – Component Cost 6. Estimated Price Analysis 74 – Manufacturer Financial Ratios – Estimated Selling Price Contact 77

15. RealSense 3D Camera Module Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 15 • This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the IR Laser Projector which is included in the Realsense F200 from Intel. • The IR Laser Projector has been found in the Realsense F200, it emits a structured pattern of class 1 infrared light used to determine the dimensional characteristics of objects by the depth camera. The module can be integrated in the laptop, tablets or added at a PC. • The IR Laser Projector is built around a low power class 1 IR laser diode and the PM53A Micro-Mirror. • The PM53A is a new resonant Micro-Mirror from STMicroelectronics for Consumer applications. • Based on complete physical analysis of the resonant Micro-Mirror and the IR laser projector, this report provides the manufacturing cost of the infrared laser projector. • The analysis of the RealSense F200 module is performed in a second report.

16. RealSense 3D Camera Module Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 16 F200 module IR Laser Projector Housing

17. RealSense 3D Camera Module Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 17 Cap back view Lateral view The IR Laser Projector is encapsulated in a metal and plastic package. X pins per package: X pins for the laser and X pins for the resonant micro-mirror by a flex. Dimensions : XXmmx XXmm x XXmm Metal frame IR Window: X x X x Xmm Window Flex, connected to the micro-mirror xxmm xxmm XXmm 2 pins, connected to the laser

18. RealSense 3D Camera Module Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 18 XXmm XXmm Resonant Micro-Mirror Die Overview PGDW: Potential Good Dies per Wafer • Die Area: XXmm² (XX x XXmm) • Nb of PGDW per 8-inch wafer: XX – Assuming scribe line of 100µm • Pad number: 3 – Connected: 3

19. RealSense 3D Camera Module Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 19

20. RealSense 3D Camera Module Return to TOC © 2015 by SYSTEM PLUS CONSULTING, all rights reserved. 20 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: • Consulting and Specific Analysis – North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc. Email: [email protected] – Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Email: [email protected] – RoW: Jean-Christophe Eloy, President & CEO, Yole Développement Email: [email protected] • Report business – North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc. Email: [email protected] – Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: [email protected] – Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: [email protected] – Korea: Hailey Yang, Business Development Manager, Korean Office Email: [email protected] • Financial services – Jean-Christophe Eloy, CEO & President Email: [email protected] • General – Email: [email protected]

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